Abietic acid encapsulated Sn-57Bi alloy nanoparticles as oxidation resistant solder material

编号 020028401

推送时间 20210329

研究领域 林产化工 

年份 2021 

类型 期刊 

语种 英语

标题 Abietic acid encapsulated Sn-57Bi alloy nanoparticles as oxidation resistant solder material

来源期刊 Colloids and Surfaces A

期 第284期

发表时间 20200530

关键词 Sn-57Bi alloy;  nanoparticles;  abietic acid encapsulation;  metal oxide reduction; 

摘要 Low-melting point solder Sn-57Bi alloy nanoparticles were synthesized and encapsulated with abietic acid (aa) thin layer to form a core-shell structure. Formation of nanoparticle enhances its mechanical strength by decreasing strain value. Comparing to traditional rosin-alloy mixture (solder paste), the core-shell structure is more efficient on metal oxide reduction due to interaction enhancement and contacting area enlargement between alloy nanoparticles and abietic acid. Thin film can be formed through reflowing core-shell nanoparticles on copper foil. This research is beneficial on developing an efficiently oxidation resistant solder for electronic packing.

服务人员 尚玮姣

服务院士 宋湛谦

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